YAMAHA- YSi-SP
3D Solder Paste Inspection Machine
基本規格
Horizontal resolution (FOV size) | 1) 25μm/12.5μm(approx.50*50mm) 2) 20μm/10μm(approx.40*40mm) 3) 15μm/7.5μm(approx.30*30mm) *All are standard selection type. |
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Applicable PCB | L510*W460mm to L50*W50mm(single lane spec) *No dual lane specification available |
Height resolution | 1μm |
Inspection items | Solder paste printing quality (volume, height, area and misalignment) |
Power supply | Single-phase AC 200/208/220/230/240 +/- 10% |
Air supply source | Airless specification |
External dimension | L904*W1,080mm*H1,478mm |
Weight | Approx. 550kg |