山善股份有限公司

YSi-SP

YAMAHA- YSi-SP

3D Solder Paste Inspection Machine
基本規格
Horizontal resolution (FOV size)1) 25μm/12.5μm(approx.50*50mm)
2) 20μm/10μm(approx.40*40mm)
3) 15μm/7.5μm(approx.30*30mm)
*All are standard selection type.
Applicable PCBL510*W460mm to L50*W50mm(single lane spec)
*No dual lane specification available
Height resolution1μm
Inspection itemsSolder paste printing quality (volume, height, area and misalignment)
Power supplySingle-phase AC 200/208/220/230/240 +/- 10%
Air supply sourceAirless specification
External dimensionL904*W1,080mm*H1,478mm
WeightApprox. 550kg

商品介紹

3D Solder Paste Inspection Machine

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